Global RTC is preparing to continue to cooperate with external research institutions on technological development and new research based on the global competitiveness in emerging and beyond technologies that it has cultivated over 20 years. Many companies and research institutes agree that collaborative research is necessary to respond to rapidly changing trends in various fields. Global RTC has drawn a lot of attention from the semiconductor industry with papers published on various topics in IEDM and VLSI over the past two to three years, which clearly demonstrates SK Hynix inc.'s technological leadership. 

In the case of SOM (Selector Only Memory), it is a device using a dual function material that can perform both memory and selector roles, and is the most complete device among the various reported cross point structures. Research results on device characteristics and VXP (Vertical Cross Point) form were announced at IEDM2022 and IMW2022, and the research results on the current 16nm cell size are scheduled to be announced at VLSI 2024. In addition to research on device characteristics, we are considering collaborative research on other applications besides CXL (Compute Express Link) pooled memory.

ACiM (Analog Computing in Memory) is a study that seeks to save energy by reducing data movement between memory and processors. It is currently being studied using RSC (Resistive Synaptic Cell) (IEDM2023), and is being researched in various other fields such as phase change materials and ferroelectric devices. Additionally, we plan to conduct collaborative research using devices.

Spin memory is a technology being studied that utilizes the spin properties of electrons in semiconductors. Our research efforts include collaborative studies on a range of devices, including SC-MRAM using STT (Spin Transfer Torque) devices (IEDM2022), as well as other types of devices like SOT (Spin-Orbit Torque). Additionally, we are exploring applications such as cache memory and DCiM (Digital Computing in Memory).

Currently, the collaboration process for the open research platform is scheduled to proceed in the following order: 1. Review of joint research possibilities through open discussion 2. Alignment of research direction after NDA (Non-Disclosure Agreement) 3. Joint research execution after SoW (Statement of Work) and contract. This research can be a simulation study based on SK Hynix inc. device characteristics, and various types of device manufacturing collaboration are also being considered. For example, there is a method of manufacturing by stacking SK Hynix inc.'s emerging memory elements on a logic gate wafer processed at the foundry.

The infrastructure construction for collaborative research in the form of a memory foundry, which has been in preparation since last year, is scheduled to be completed this year, and we will continue to strive to build a more advanced research ecosystem with collaborative research customers through pre-pilot collaboration. Moreover, in order to tackle research topics that may be challenging for SK Hynix inc., we are making preparations to send highly skilled Global RTC researchers to overseas research institutes for joint research endeavors.

With the advancement of semiconductor technology, the challenges facing the development of next-generation semiconductor products are becoming more complex. In order to effectively respond to the rapidly changing external environment and ICT trends and achieve the growth of future semiconductor technology, we plan to create collaboration with global research institutions staffed by various experts through ORP (Open Research Platform). We believe that this will ultimately result in a solution that can reduce research periods and costs and accelerate the realization of future technologies.